Miércoles 10 de marzo: 09:00-18:00
Jueves 11 de marzo: 09:00-17:30
Time: 2:30 pm - 2:50 pm
Date: 11/03/26
Synopsis
In response to evolving market demands, Dow developed XUS 51127, a next-generation EPDM grade engineered to address key challenges in compounding and extrusion. The industry increasingly requires materials that support high filler loading while maintaining superior mechanical properties, fast cure rates, and robust processing behavior. XUS 51127 was designed to meet these needs through unique molecular architecture.
This new grade features high molecular weight, broad molecular weight distribution, very high ENB content, enhanced long-chain branching, and elevated ethylene content. These attributes collectively enable improved mechanical performance, compression set and low temperature flexibility, while also promoting quick skin formation, fast cure with higher line speeds, and better extrudability. The compounds exhibit smooth surface finish, dimensional stability, and green strength. Therefore, this grade is ideal for higher manufacturing efficiency because it can be positioned as a solution for multiple applications, including weather seals like dry sponge, fast extrusion dense, microdense and electrically resistive profiles as well as hoses.
By consolidating performance and processing benefits into one versatile grade, XUS 51127 simplifies logistics and inventory management for compounders and manufacturers. This presentation will cover the design rationale, key performance metrics, and application case studies, demonstrating how XUS 51127 delivers value across diverse product lines.
SPEAKERS
Dario BartoliniTechnical service and development engineer - Dow Packaging and Specialty Plastics - Resinex
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